The fastest probing tester that measures the electrical and optical characteristics of chip LEDs in the expanded sheet state and wafer state, and sorts out good and defective products.
The fastest mapping sorter that supplies chip LEDs measured by a tester in an expanded sheet state, sorts them based on rank classification data, and stores them.
An automatic visual inspection device that supplies chip LEDs from a magazine cassette in an expanded sheet state and performs mapping processing and visual inspection with a high-resolution camera.
Measure the electrical and optical characteristics of chip LEDs and sort out non-defective and defective products. This LED tester uses a chip transfer method and is suitable for device research and evaluation.
The electrical and optical characteristics of flip-chip LEDs are measured on the sheet, and good and defective products are sorted. This is a verification device that uses the wafer prober method and is aimed at mass production.
The electrical and optical characteristics of flip-chip LEDs and sorts out non-defective and defective products. This is a verification device that uses a chip transfer method to evaluate devices and perform mass production measurement.
A high-speed epoxy die bonder compatible with multi-chip bonders. The insert on the expanding sheet is supplied and die-bonded to the work holder according to the customer's specifications.