This is a tester for inspecting, sorting and classifying the electrical and optical characteristics of TO-CAN package LD.
It is a mass-produced high-speed tester that supplies, sorts and stores are fully automatically.

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This is a tester for inspecting, sorting and classifying the electrical and optical characteristics of frame type LD.
It is a mass-produced high-speed tester that supplies, sorts, and stores are fully automatically.

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This is a tester for inspecting the electrical and optical characteristics of the chip bar LD.

Full-automatic supply, measurement and classified storage.

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This is a mass production  tester that inspects the electrical and optical characteristics of bare chip LD.

It is a high-speed inspection device.

Measurement, supply and classified storage are carried out automatically at 

1-2temperature(20℃～95℃）and 2-4 position.

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This is a mass-produced high-speed inspection tester for the electrical and optical characteristics of bare chip LD.

Measurement, supply and classified storage are carried out automatically at 1-2-3 temperature (-40 ° to 25 ° C to 95 ° C) and 2-4 position.

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LD temperature characteristics for the purpose of 3 temperature (-40 ° to 25 ° C to 95 ° C) characteristic tests of TO-CAN LD.

The CAN package and LD in the chip carrier state are mounted on a dedicated jig board, measurement and judgment are automatically performed while controlling the temperature.

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The electrical and optical characteristics of TO-CAN LD can be adjusted at 1 temperature in the range of -10 ° C ~.

It is a automatically machine.

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This is a tester for researching evaluation that supports LD of various packages with a special jig.
The workpiece is set manually and all items are automatically measured and judged.

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A desktop type simple LD tester for research evaluation.

It corresponds to LD of various packages with a special jig.

The workpiece is set manually and IL, λ, and FFP are measured automatically.

Selecting a combination of long wave or short wave, low temperature to high temperature or normal temperature to high temperature as specifications.

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This is a tester for high power type compatible with TO-CAN, chip bar LD, COS, etc.

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LD tester for VCSEL package.

The LD emission point can be detected by image processing and highly accurate measurement can be performed.

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LD tester for VCSEL wafers.

Each item of IL, λ, NFP, and FFP is measured for each chip in the wafer state.

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This is an automatic visual inspection machine for inspecting the top and end faces of LD chips.
Poor appearance of the chip while stuck to the ring sheet or gel pack

Detect

By removing defective products, only non-defective products can be left on the sheet.

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Transporting tray and burn-in board /

LD3600 that transfer robot that inserts / removes TO-CAN LD with a jig board.

We design equipment that meets customer specifications, such as various packages, various trays, and jig boards.

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