​Tester

LD Chip Visual

Inspection Equipment

AOI1000A

Overview

This device captures images of the surface of the chip from the top and diagonal sides with the Edge emitting laser (EEL)  diode bare chip that attached to the Grip ring or gel pack and inspects the appearance.

There are three surfaces to be visually inspected: the upper surface, the front of the light emitting end face, and the rear of the light emitting end face.

NG judgment products are picked up and discarded in the NG BOX.

Test Object

Edge emitting laser (EEL)  diode bare chip

Wafer Mapping Function

Wafer mapping is performed at high speed before measurement.

Supply

・ 6 “Grip ring x1

・ 2 “Gel pack x4

Inspection Target Surface

・ Top surface

・ Front surface of light emitting end face

・ Rear surface of light emitting end face

Inspection Item

・ Cracks, scratches, scratches

・ Dirt, corrosion, poor coating

* Details will be decided after preparing a sample limit for each item.

Copyright 2012 ALPHAX Co.,LTD. All rights reserved