LD Chip Visual
This device captures images of the surface of the chip from the top and diagonal sides with the Edge emitting laser (EEL) diode bare chip that attached to the Grip ring or gel pack and inspects the appearance.
There are three surfaces to be visually inspected: the upper surface, the front of the light emitting end face, and the rear of the light emitting end face.
NG judgment products are picked up and discarded in the NG BOX.
Edge emitting laser (EEL) diode bare chip
Wafer Mapping Function
Wafer mapping is performed at high speed before measurement.
・ 6 “Grip ring x1
・ 2 “Gel pack x4
Inspection Target Surface
・ Top surface
・ Front surface of light emitting end face
・ Rear surface of light emitting end face
・ Cracks, scratches, scratches
・ Dirt, corrosion, poor coating
* Details will be decided after preparing a sample limit for each item.